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In our Maidenhead, UK facility, we have eight separate laboratories providing a range of security, fault and quality analysis services for all types of chips and other hardware devices. SiVenture offers these comprehensive facilities under one roof, saving time while simplifying the testing process.

SiVenture uses a comprehensive set of tools for preparing, de-processing, probing and modifying samples. We also have a wide range of microscopy - optical, focused ion beam, scanning electron and scanning probe - as well as comprehensive electronic measurement and signal analysis tool-sets.

Laboratory Services offered include:

Failure and process analysis

SiVenture undertakes various tasks ranging from defect classification to establishing the causes of individual failures using a wide range of techniques such as FIB cross sectioning as well as selective layer deprocessing by RIE, Optical and SEM.

Circuit Edit

SiVenture is able to edit the first silicon to test redesign ideas. For short-notice chip rewiring, we have a state-of-the-art FIB service to ensure modifications can be made on time and within budget.

Micromachining and nanotechnology

SiVenture's submicron imaging tools and our capability to machine with a 10nm ion probe enable us to prototype even the smallest structures. Using our Scanning Probe Microscope, we can image and manipulate down to individual atoms.

Specialized device processing

Our Maidenhead facility contains much of the equipment required for specialized processing of research structures. The entire facility is clean to Class 10000 and spaces are available for Class 100 processing.

Circuit and device testing

SiVenture can help you fix your designs by implementing repairs to non-functioning devices using a range of electrical test equipment. We are able to provide the answers before and after FIB circuit edit.

Common Criteria testing

SiVenture can evaluate the security of your chips and hardware devices to Common Criteria standards. We are a UKAS accredited testing laboratory No. 2722.

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