Whatever your needs in circuit analysis or fault detection,
focused ion beams (FIB) enable you to get to the heart of the
problem. While the FIB is an imaging tool, just like a SEM,
it is much more. The ion beam is also an in-situ sample preparation
tool enabling you to cut cross-sections in exactly the right
place to image the defect. You can make multiple cuts through
a defect to build up a three-dimensional picture.
FIB also facilitates circuit edit. You cannot use
a soldering iron and wire-cutters to modify an integrated
circuit chip with circuit wires as small
as 0.13 microns and from up to eight layers of tracks snaking
over and under each other. Only FIB has the necessary precision
to cut these
tracks, make new connections and generally rewire these circuits.
You get working examples to help you reach market sooner.
This micro-machining tool can be used in many creative ways
by SiVenture's experienced team. For example, if you need
higher resolution, FIB can prepare a TEM section around the
feature to be imaged. This allows you to accurately measure
gate oxide thickness to sub-nanometer precision, or to image
crystalline dislocations at a birds-beak.
For more information, please see the Silicon Modification - FIB data sheet.
|
