Whatever your needs in circuit analysis or fault detection, focused ion beams (FIB) enable you to get to the heart of the problem. While the FIB is an imaging tool, just like a SEM, it is much more. The ion beam is also an in-situ sample preparation tool enabling you to cut cross-sections in exactly the right place to image the defect. You can make multiple cuts through a defect to build up a three-dimensional picture.
FIB also facilitates circuit edit. You cannot use a soldering iron and wire-cutters to modify an integrated circuit chip with circuit wires as small as 0.13 microns and from up to eight layers of tracks snaking over and under each other. Only FIB has the necessary precision to cut these tracks, make new connections and generally rewire these circuits. You get working examples to help you reach market sooner.
This micro-machining tool can be used in many creative ways by SiVenture's experienced team. For example, if you need higher resolution, FIB can prepare a TEM section around the feature to be imaged. This allows you to accurately measure gate oxide thickness to sub-nanometer precision, or to image crystalline dislocations at a birds-beak.
